Publications
2022 (Journal/conference papers)
Dey, Shuv, and Yogendra Joshi. “Recent progress and challenges in microscale urban heat modeling and measurement for urban engineering applications.” Journal of Thermal Science and Engineering Applications 15, no. 1 (2023): 010801.
A. M. Muslu, V. Smet and Y. Joshi, “Compact SiC Power Module With Integrated Power Delivery and Cooling,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 12, pp. 1939-1948, Dec. 2022, doi: 10.1109/TCPMT.2022.3231804.
A. Osman and Y. Joshi, “Simulation and Experimental Investigation of Single and Two-phase Cold Plate Using HFE-7200 with Discrete Heat Sources,” 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Dublin, Ireland, 2022, pp. 1-7, doi: 10.1109/THERMINIC57263.2022.9950676.
2021 (Journal/conference papers)
Broughton, Justin, and Yogendra K. Joshi. “Flow boiling in geometrically modified microchannels.” Physics of Fluids 33, no. 10 (2021).
A. M. Muslu, V. Smet and Y. Joshi, “Multi-physics Modeling of a Power Electronics Package with Integrated Cooling,” 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Berlin, Germany, 2021, pp. 1-6, doi: 10.1109/THERMINIC52472.2021.9626501.
A. M. Muslu, R. Wong, V. Smet and Y. Joshi, “Heat Spreading and Heat Removal Needs of a Novel Power Electronics Package with Integrated Cooling,” 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2021, pp. 314-323, doi: 10.1109/ITherm51669.2021.9503214.
Li, Yongtong, Liang Gong, Minghai Xu, and Yogendra Joshi. “A review of thermo-hydraulic performance of metal foam and its application as heat sinks for electronics cooling.” Journal of Electronic Packaging 143, no. 3 (2021): 030801.
2020 (Journal/conference papers)
Li, Wenming, and Yogendra Joshi. “Capillary-assisted evaporation/boiling in PDMS microchannel integrated with wicking microstructures.” Langmuir 36.41 (2020): 12143-12149.
Dey, Y. Joshi, and J. M. Brown, “Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies,” in ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, CA, USA, 2019 2019: American Society of Mechanical Engineers, 2019, p. 10, doi: 10.1115/ipack2019-6515. [Online]. Available: https://dx.doi.org/10.1115/IPACK2019-6515
Dey, J. M. Brown, and Y. Joshi, “Packaging Environmental Sensors for Monitoring Urban-Microclimates,” ASME Journal of Engineering for Sustainable Buildings and Cities, vol. 1, no. 3, 2020, doi: 10.1115/1.4047422.
J. Broughton and Y. Joshi, “Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams,” 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Lecco, Italy, 2019, pp. 1-5, doi: 10.1109/THERMINIC.2019.8923562.
Broughton, Justin, and Joshi, Yogendra. “A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management.” ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Anaheim, California, USA. October 7–9, 2019. V001T06A023. ASME. https://doi.org/10.1115/IPACK2019-6519
Broughton, J., and Joshi, Y. K. (June 8, 2020). “Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams.” ASME. J. Heat Transfer. August 2020; 142(8): 082201. https://doi.org/10.1115/1.4046972
J. Athavale, M. Yoda, and Y. Joshi, “Comparison of Data Driven Modeling Approaches for Temperature Prediction in Data Centers”, Int, J. Heat and Mass Transfer, Volume 135, pp. 1039-1052 (2019).
Y. Nakajo, J. Athavale, M. Yoda, Y. Joshi, and H. Nishi, “Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures”, ASME J. Electron. Packag, 2019 (To Appear).
2018 (Journal/conference papers)
Y. Fulpagare, Y. Joshi, A. Bhargav, “Rack Level Transient CFD Modeling of Data Center”, Int. J. Numerical Methods for Heat and Fluid Flow, Vol. 28, pp. 381-394, 2018.
P. Asrar, X. Zhang, C. Green, M. Bakir, Y. Joshi, “Flow Boiling of R245fa in a Microgap with Staggered Circular Cylindrical Pin Fins”, Int, J. Heat and Mass Transfer, Vol. 121, pp. 329-342, 2018.
S. Cho, R. Tummala, Y. Joshi, “Capillary Performance of Micropillar Arrays in Different Arrangements”, Nanoscale and Microscale Thermophysical Engineering, 22:2, 97-113, DOI: 10.1080/15567265.2018.1431749, 2018.
J. Athavale, Y. Joshi, and M. Yoda, “Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles”, ASME J. Electron. Packag, Vol. 140(1), pp. 010902 (10 pages), 2018.
S. Cho and Y. Joshi, “Thermal Performance of Microelectronic Substrates with Sub-mm Integrated Vapor Chamber”, ASME. J. Heat Transfer, doi:10.1115/1.4042328, HT-18-1568, 2018.
J. Broughton, V. Smet, R. R. Tummala and Y. Joshi, “Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes”, ASME J. Electron. Packag, 140(4), 040801 (11 pages), 2018.
Y. Li, L. Gong, M. Xu, Y. Joshi, “Thermal Performance Analysis of Biporous Metal Foam Heat Sink”, ASME. J. Heat Transfer, Vol 139(5), 052005, 2017, (8 pages)
D. Lorenzini, Y. Joshi, “Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux”, ASME. J. Heat Transfer, Vol. 140, pp. 0111501 (11 pages), 2017.
D. Lorenzini, Y. Joshi, “Comparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps”, ASME. J. Heat Transfer, Vol. 139, pp. 111506 (10 pages), 2017.
Banafsheh Barabadi, Satish Kumar and Yogendra K. Joshi, “Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method”, ASME J. Heat Transfer 139(7), 072101 (10 pages), 2017
Jian-Fei Zhang, Y. Joshi, Wen-Quan Tao, “Single Phase Laminar Flow and Heat Transfer Characteristics of Microgaps with Longitudinal Vortex Generator Array”, Int. J. Heat Mass Transfer, Vol. 111, pp. 484-494, 2017.
“Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center”, V. K. Arghode, T. Kang, Y. Joshi, W. Phelps and M. Michaels, ASME. J. Electron. Packag 139(1), 011007 (8 pages), 2017.
Z. Wan, Y. Joshi, “Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling”, Int. J. Heat Mass Transfer, Vol. 115, pp. 115-126, 2017.
W. Yueh, Z. Wan, H. Xiao, S. Yalamanchili, Y. Joshi, S. Mukhopadhyay, “Active Fluidic Cooling on Energy Constrained System-on-Chip Systems”, IEEE Components and Manuf. Technology, Vol 7, pp. 1813-1822, 2017.
R. Khalid, A. P. Wemhoff, Y. Joshi, “Energy and Exergy Analysis of Modular Data Centers”, IEEE Transactions on Components and Manuf. Technology, Vol 7, pp. 1440 – 1452, 2017.
T. E. Sarvey, Y. Hu, C. E. Green, P.A. Kottke, D. C. Woodrum, Y. Joshi, A. G. Fedorov, S. K. Sitaraman, M. S. Bakir, “Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps”, IEEE Transactions on Components and Manuf. Technology, Vol. 7, pp. 1465-1475, 2017.
T. Noguchi, J. Wijekoon, Y. Joshi, M. Yoda, H. Nishi, 2016, “Shutter control for cooling air flow management in data center servers”, 42nd Annual Conference of the IEEE Industrial Electronics Society (IECON).
S. Mok, S. Kumar, R.R. Hutchins, Y.K. Joshi, 2016, “Impact of a rotary regenerative heat exchanger on energy efficiency of an air cooled data center”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
D.C. Woodrum, X. Zhang, P.A. Kottke, Y.K. Joshi, A.G. Fedorov, M.S. Bakir, S.K. Sitaraman, 2016, “Reliability assessment of hydrofoil-shaped micro-pin fins”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
X. Han, Y. Joshi, A. Fedorov, 2016, “Flow boiling of water at sub-atmospheric pressure in staggered micro pin-fin heat sink”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
R. Abbaspour, D.C. Woodrum, P.A. Kottke, T.E. Sarvey, C.E. Green, Y.K. Joshi, A.G. Fedorov, S.K. Sitaraman, M.S. Bakir, 2016, “Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
X. Zhang, M.H. Nasr, D.C. Woodrum, C.E. Green, P.A. Kottke, T.E. Sarvey, Y.K. Joshi, S.K. Sitaraman, A.G. Fedorov, M.S. Bakir, 2016, “Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
R. Khalid, Y. Joshi, Aaron Wemhoff, 2016, “Rapid modeling tools for energy analysis of modular data centers”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
M.H. Nasr, C.E. Green, P.A. Kottke, X. Zhang, T.E. Sarvey, Y.K. Joshi, M.S. Bakir, A.G. Fedorov, 2016, “Extreme-microgap (x-µgap) based hotspot thermal management with refrigerant flow boiling”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
D. Lorenzini, Y. Joshi, 2016, “CFD study of flow boiling in silicon microgaps with staggered pin fins for the 3D-stacking of ICs”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
J. Athavale, Y. Joshi, M. Yoda, W. Phelps, 2016, “Impact of active tiles on data center flow and temperature distribution”, 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
P. Asrar, X. Zhang, C.E. Green, P.A. Kottke, T.E. Sarvey, A. Fedorov, M.S. Bakir, Y.K. Joshi, 2016, “Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins”, 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Y. Li, L. Gong, M. Xu, Y. Joshi, 2016, “Thermal Performance Analysis of Bi-Porous Metal Foam Heat Sink”, ASME 2016 5th International Conference on Micro/Nanoscale Heat and Mass Transfer.
V. Sahu, Y.K. Joshi, A.G. Fedorov, J.-H. Bahk, X. Wang, A. Shakouri, 2015, “Experimental characterization of hybrid solid-state and fluidic cooling for thermal management of localized hotspots”, IEEE Transactions on Components, Packaging and Manufacturing Technology 5(1), 57-64.
V.K. Arghode, Y. Joshi, 2015, “Measurement of Air Flow Rate Sensitivity to the Differential Pressure across a Server Rack in a Data Center”, Journal of Electronic Packaging, Accepted manuscript.
V. Sundaralingam, V.K. Arghode, Y. Joshi, W. Phelps, 2015, “Experimental characterization of various cold aisle containment configurations for data centers”, Journal of Electronic Packaging 137(1), 011007.
X. Han, Y.K. Joshi, 2015, “Compact model-based microfluidic controller for energy efficient thermal management using single tier and three-dimensional stacked pin-fin enhanced microgap”, Journal of Electronic Packaging 137(1), 011008.
V.K. Arghode, Y. Joshi, 2015, “Experimental investigation of air flow through a perforated tile in a raised floor data center”, Journal of Electronic Packaging 137(1), 011011.
V.K. Arghode, V. Sundaralingam, Y. Joshi, 2015, “Air flow management in a contained cold aisle using active fan tiles for energy efficient data center operation”, Heat Transfer Engineering, Accepted manuscript.
E. Cruz, Y. Joshi, 2015, “Coupled inviscid-viscous solution method for bounded domains: Application to data-center thermal management”, International Journal of Heat and Mass Transfer 85, 181-194.
B. Barabadi, S. Kumar, V. Sukharev, Y.K. Joshi, 2015, “Multiscale Transient Thermal Analysis of Microelectronics” Journal of Electronic Packaging 137(3), 031002.
A.J. McNamara, Y. Joshi, Z. Zhang, K.-S. Moon, Z. Lin, Y. Yao, C.-P. Wong, W. Lin, 2015, “Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials”, Journal of Electronic Packaging 137(3), 031014.
A.J. McNamara, Y. Joshi, Z. Zhang, 2015, “Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material”, International Journal of Thermal Sciences 96, 221-226.
2015 (Conference papers)
D. Lorenzini, Y.K. Joshi, 2015, “CFD analysis of flow boiling in a silicon microchannel with non-uniform heat flux”, Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACK & ICNMM, July 6-9, San Francisco, California, USA.
S. Cho, Y.K. Joshi, 2015, “Thermal performance enhancement of glass interposer”, Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACK & ICNMM, July 6-9, San Francisco, California, USA.
X. Zhang, X. Han, T.E. Sarvey, C.E. Green, P.A. Kottke, A.G. Fedorov, Y. Joshi, M.S. Bakir, 2015, “3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications”, Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACK & ICNMM, July 6-9, San Francisco, California, USA.
C.E. Green, P.A. Kottke, T.E. Sarvey, A.G. Fedorov, Y. Joshi, M.S. Bakir, 2015, “Performance and integration implications of addressing localized hotspots through two approaches: clustering of micro pin-fins and dedicated microgap coolers”, Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACK & ICNMM, July 6-9, San Francisco, California, USA.
T.H. Sherer II, Y. Joshi, 2015, “Numerical and experimental investigation of shell-and-tube phase change material thermal storage unit”, Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, InterPACK & ICNMM, July 6-9, San Francisco, California, USA.
D. Lorenzini and Y.K. Joshi, 2015, “Effect of surface wettability on flow boiling in a microchannel”, Proceedings of CHT-2015 International Symposium on Advances in Computational Heat Transfer, May 25-29, Piscataway, USA.
V.K. Arghode, Y. Joshi, 2015, “Evaluation of modified body force (MBF) model for rapid air flow modeling through perforated tiles”, 2015 31th Annual Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
M.S. Kim, S. Cho, J. Min, M.R. Pulugurtha, N. Huang, S. Sitaraman, V. Sundaram, M. Velez, A. Ravindran, Y. Joshi, R. Tummala, “Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation”, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1163-1167.
Y. Yao, J.N. Tey, Z. Li, J. Wei, K. Bennett, A. McNamara, Y. Joshi, R. Lee, S.Tan, S. Nai, M. Ling, C.-P. Wong, 2014, “High-quality vertically aligned carbon nanotubes for applications as thermal interface materials”, IEEE Transactions on Components, Packaging and Manufacturing Technology 4(2), 232-239.
V.K. Arghode, Y. Joshi, 2014, “Room level modeling of air flow in a contained data center aisle”, Journal of Electronic Packaging 136 (1), 011011.
V. Sahu, A.G. Fedorov, Y.K. Joshi, 2014, “Computational and experimental investigation of thermal coupling between superlattice coolers”, IEEE Transactions on Components, Packaging and Manufacturing Technology 4(4), 622-631.
R. Ghosh, Y. Joshi, 2014, “Proper orthogonal decomposition-based modeling framework for improving spatial resolution of measured temperature data”, IEEE Transactions on Components, Packaging and Manufacturing Technology 4(5), 848-858.
R. Ghosh, Y. Joshi, 2014, “Rapid temperature predictions in data centers using multi-parameter proper orthogonal decomposition”, Numerical Heat Transfer, Part A: Applications 66(1), 41-63.
C.E. Green, A.G. Fedorov, Y.K. Joshi, 2014, “Time scale matching of dynamically operated devices using composite thermal capacitors”, Microelectronics Journal 45(8), 1069-1078.
V. Sahu, A.G. Fedorov, Y.K. Joshi, 2014, “Transient characterization of hybrid microfluidic-thermoelectric cooling scheme for dynamic thermal management of microprocessor”, Journal of Electronic Packaging 136(3), 031014.
A.-T. Chien, S. Cho, Y. Joshi, S. Kumar, 2014, “Electrical conductivity and Joule heating of polyacrylonitrile/carbon nanotube composite fibers”, Polymer 55(26), 6896-6905.
Z. Wan, H. Xiao, Y. Joshi, S. Yalamanchili, 2014, “Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs”, Microelectronics Journal 45(12), 1814-1821.
2014 (Conference papers)
H. Xiao, Z. Wan, S. Yalamanchili, Y. Joshi, 2014, “Leakage power characterization and minimization in 3D stacked multi-core chips with microfluidic cooling” 2014 30th Annual Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 207-212.
P. Kottke, T.M. Yun, C.E. Green, Y.K. Joshi, A.G. Fedorov, 2014, “Two phase convective cooling for ultra-high power dissipation in microprocessors”, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 199-204.
Z. Wan, Y. Joshi, 2014, “Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling”, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 649-657.
V.K. Arghode, Y. Joshi, 2014, “Rapid modeling of air flow through perforated tiles in a raised floor data center”, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1354-1365.
S. Cho, Y. Sato, V. Sundaram, Y. Joshi, R. Tummala, 2014, “Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers”, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1247-1252.
Z. Wan, H. Xiao, Y. Joshi, S. Yalamanchili, “Thermal and electrical performance of microfluidically cooled 3D ICs with non-uniform power dissipation”, 2014 Lester Eastman Conference on High Performance Devices, 1-4.
Z. Wan, W. Yueh, Y. Joshi, S. Mukhopadhyay, 2014, “Enhancement in CMOS chip performance through microfluidic cooling”, 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 1-5.
R. Ghosh, Y. Joshi, 2013, “Error estimation in POD-based dynamic reduced-order thermal modeling of data centers”, International Journal of Heat and Mass Transfer 57 (2), 698-707.
S. Narayanan, A.G. Fedorov, Y. Joshi, 2013, “Heat and mass transfer during evaporation of thin liquid films confined by nanoporous membranes subjected to air jet impingement”, International Journal of Heat and Mass Transfer 58 (1), 300-311.
V.K. Arghode, Y. Joshi, 2013, “Modeling strategies for air flow through perforated tiles in a data center”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (5), 800-810.
V.K. Arghode, V. Sundaralingam, Y. Joshi, W. Phelps, 2013, “Thermal characteristics of open and contained data center cold aisle”, Journal of Heat Transfer 135 (6), 061901.
V.K. Arghode, P. Kumar, Y. Joshi, T. Weiss, G. Meyer, 2013, “Rack level modeling of air flow through perforated tile in a data center”, Journal of Electronic Packaging 135 (3), 030902.
E. Cruz, Y. Joshi, “Inviscid and viscous numerical models compared to experimental data in a small data center test cell”, Journal of Electronic Packaging 135 (3), 030904.
K. Kota, L. Burton, Y. Joshi, “Performance of an air-cooled heat sink channel with microscale dimples under transitional flow conditions”, Journal of Heat Transfer 135 (11), 111005.
R. Ghosh, Y. Joshi, 2013, “Error estimation in POD-based dynamic reduced-order thermal modeling of data centers”, International Journal of Heat and Mass Transfer 57 (2), 698-707.
2013 (Conference papers)
Sundaralingam, V.K. Arghode, Y. Joshi, 2013, “Experimental characterization of cold aisle containment for data centers”, Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March 17-21, San Jose, CA.
R. Ghosh, Y. Joshi, L. Klein, H.F. Hamann, 2013, “Reduced-order modeling framework for improving spatial resolution of data center transient air temperatures”, Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March 17-21, San Jose, CA, USA.
S. Cho, Y. Joshi, V. Sundaram, Y. Sato, R. Tummala, 2013, “Comparison of thermal performance between glass and silicon interposers”, Electronic Components and Technology Conference (ECTC), May 28-31, Las Vegas, NV, USA.
X. Han, Y. Joshi, 2013, “Compact model based microfluidic controller for energy efficient thermal management using pin-fin enhanced micro gap”, ASME 2013 Heat Transfer Summer Conference, July 14-19, Minneapolis, Minnesota, USA.
Z. Wan, Y. Joshi, 2013, “Transient compact modeling of 3D stacked die inter-tier microfluidic cooling under non-uniform heat flux”, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, July 16–18, Burlingame, California, USA.
A. Sinha, K. Kota, P. Hidalgo, Y. Joshi, A. Glezer, 2013, “Novel immersion cooling technique for a 3D chip stack”, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, July 16–18, Burlingame, California, USA.
M.K. Patterson, R. Martin, J.B. von Oehsen, J. Pepin, Y. Joshi, V.K. Arghode, Robin Steinbrecher, Jeff King, 2013, “A field investigation into the limits of high-density air-cooling”, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, July 16–18, Burlingame, California, USA.
Z. Wan, Y.K. Joshi, 2013, “Pressure drop and heat transfer characteristics of pin fin enhanced microgaps in single phase microfluidic cooling”, ASME 2013 International Mechanical Engineering Congress and Exposition.
S.A. Isaacs, Y. Joshi, Y. Zhang, M.S. Bakir, Y.J. Kim, “Two-Phase Flow and Heat Transfer in Pin-Fin Enhanced Micro-Gaps With Non-Uniform Heating”, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer.
Pramod Warrier, Aravind Sathyanarayana, Dadasaheb V. Patil, Stefan France, Yogendra Joshi, and Amyn S. Teja, Novel Heat Transfer Fluids for Direct Immersion Cooling of Electronic Systems, International Journal of Heat and Mass Transfer, 55, 3379, 2012.
Rajat Ghosh, Vikneshan Sundaralingam, and Yogendra Joshi, “Effect of Rack Server Population on Temperatures in Data Centers,” ITherm 2012.
X. Han, Y.Joshi, “Energy Reduction in Server Cooling Via Real Time Thermal Control”, SEMI-THERM 2012.
X. Han, Y. Joshi, “Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management of Single Tier and 3D Chips”, ICNMM 2012.
Zhimin Wan, Yoon Jo Kim, Yogendra Joshi, “Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux”, 2012 International Mechanical Engineering Congress & Exposition of ASME, Houston, Texas, Nov. 9-15, 2012.
Aravind Sathyanarayana, Pramod Warrier, Yunhyeok Im, Yogendra Joshi, and Amyn S. Teja, Pool Boiling of a HFE 7200 – C4H4F6O Mixture on a Hybrid Micro-Nanostructured Surface, Journal of Nanotechnology in Engineering and Medicine, (Submitted).
Aravind Sathyanarayana, Pramod Warrier, Yogendra Joshi and Amyn S. Teja, Saturated and Subcooled Pool Boiling of HFE-7200 Mixtures on Copper Nanowire Surface, Frontiers in Heat and Mass Transfer, Vol. 2, 043007, 2011.
Sinha, A., Joshi, Y. K., 2011, “Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger,” ASME J of Electronics Packaging, December 2011, Vol. 133. Issue 4.
Rajat Ghosh, Vikneshan Sundaralingam, Steven Isaacs, Pramod Kumar and Yogendra Joshi, “Transient Air Temperature Measurements in a Data Center,” ISHMT 2011.
Rajat Ghosh, Pramod Kumar, Vikneshan Sundaralingam, and Yogendra Joshi, “Experimental Characterization of Transient Temperature Evolution in a Data Center Facility,” ISTP-22, 2011.
Rajat Ghosh and Yogendra Joshi, “Dynamic Reduced-order Thermal Modeling of Data Center Air Temperatures,” IPACK2011-52029, InterPACK 2011.
E. Samadiani, Y. Joshi, 2010, “Multi-Parameter Model Reduction in Multi-Scale Convective Systems,” International Journal of Heat and Mass Transfer, Volume 53, pp 2193-2205.
E. Samadiani, Y. Joshi, J. K. Allen, F. Mistree, 2010, “Adaptable Robust Design of Multi-scale Convective Systems Applied to Energy Efficient Data Centers,” Numerical Heat Transfer, Part A: Applications, Volume 57, Issue 2, pp 69-100.
Krishnan, S., Federov, A., Joshi. Y., “Experimental characterization of a micro-scale thin film evaporative cooling devise,” ITHERM – 2010, Las Vegas, USA.
Krishnan, S., Federov, A., Joshi. Y., “Gas assisted thin-film evaporation for hotspot thermal management,” International Heat Transfer Conference – 14, 2010, Washington DC, USA.
V. Sahu, Y. Joshi, A. Fedorov, “Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots,” 2010 IHTC.
Krishnan, S., Federov, A., Joshi. Y., “Gas-Assisted Thin-Film Evaporation from Confined Spaces for Dissipation of High Heat Fluxes,” Nanoscale and micro-scale thermophysical engineering, Volume 13, Issue 1, Jan 09.
Krishnan, S., Federov, A., Joshi. Y., “Gas assisted thin-film evaporation for dissipation of high heat fluxes from confined spaces,” TECHCON- 2009, Austin, USA.
Sinha, A., Joshi, Y. K., 2009, “Thermo-Electric Assisted Adsorption Cooling System for Harsh Environment Electronics: Issues With Heat Regeneration.’ Proceedings of the ASME Interpack Conference, San Francisco, 2009.
Sinha, A., Joshi, Y. K., 2009, “Performance of Thermo-Electric Based Regenerative Adsorption Cooling System for Harsh Environment Electronics,” ASME IMECE Conference, 2009.
Sinha, A., Joshi, Y. K., 2009, “Simulation of a Thermo-Electric Adsorption Heat Pump for Harsh Environment Electronics Cooling,” Advanced Technology Workshop, IMAPS Conference, Palo Alto CA, 2009.
Sinha, A., Joshi, Y. K., 2009, “A Modified Adsorption Cycle for Cooling of Harsh Environment Electronics,” Journal of Adsorption (Springer Publication).
Sinha, A., Joshi, Y. K., 2009, “Application of Thermo-Electric-Adsorption Cooler for Harsh Environment Electronics under Varying Heat Load,” ASME Journal of Thermal Science and Engineering Applications.
V. Sahu, Y. Joshi, A. Fedorov, “Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots,” TECHCON 2009.
E. Samadiani, Y. Joshi, F. Mistree, 2008, “The Thermal Design of A Next Generation Data Center: A Conceptual Exposition,” Journal of Electronic Packaging, December 2008, Volume 130, Issue 4, pp 0411041-0411048.
V. Sahu, Y. Joshi, A. Fedorov, “Hybrid Solid State/Fluidic Cooling for Hotspot Removal,” Eleventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008.
V. Sahu, Y. K. Joshi, and A. G. Fedorov, “Hybrid solid state/fluidic cooling for hotspot removal,” 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. pp. 626-631.
V. Sahu, Y. Joshi, A. Fedorov, “Hybrid Solid State/Fluidic Cooling for Hotspot Removal,” TECHCON 2008.
Sinha, A., Joshi, Y. K., Storm, B., “Thermo-Electric Cooler Based Regenerative Adsorption System for High Temperature Electronics,” Proceedings of the ASME Interpack Conference, Vancouver, Canada, 2007.
Krishnan, S., Federov, A., Joshi. Y., “Perspiration nano-patch for hotspot thermal management,” Interpack 07, Vancouver, Canada.
Q. Nie and Y. Joshi, Multiscale Thermal Modeling of Microsystem Enclosure, Proceedings of The 17th International Symposium on Transport Phenomena, September 4-8, 2006, Toyama, JAPAN.
Q. Nie and Y. Joshi, Multi-scale Thermal Modeling Methodology for Electronics Cabinet, Proceedings of ITHERM 2006, May 30-June 2, 2006, San Diego, CA.
D. Gerlach and Y. Joshi, Parametric Thermal Modeling of 3D Stacked Chip Electronics with Interleaved
Solid Heat Spreaders, Proceedings of ITHERM 2006, May 30-June 2, 2006, San Diego, CA.
C. Coggins, D. Gerlach, Y. Joshi, and A. Federov, Compact Low Temperature Refrigeration of Microprocessors, Proceedings of the International Refrigeration and Air Conditioning Conference at Purdue University, 2006.
S. Suman, A. Federov, and Y. Joshi, Regenerative Fluid Loop Concept for Performance Enhancement of Adsorption Refrigeration System, Proceedings of the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2006.
D. Gerlach and Y. Joshi, Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate, Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition, November 5-11, 2005, Orlando, FL.
J. Rambo and Y. Joshi, Supply Air Distribution from a Single Air Handling Unit in a Raised Floor Plenum Data Center, Proc. ISHMT/ASME’04 – Joint Indian Society of Heat and Mass Transfer – American Society of Mechanical Engineers Heat and Mass Transfer Conference, Kalpakkam India, 2004.
J. Rambo and Y. Joshi, “Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers”, to appear in: The Handbook of Numerical Heat Transfer, Vol. 2, W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy Editors, John Wiley, 2004.
Y. Joshi, Liquid Cooling of High-Performance Microcomponents and Microsystems Miniature Flow
Loops for Thermal Management, Advanced Packaging, Vol. 13 No. 1, 35-36, January 2004.
S. Murthy, Y. Joshi, and W. Nakayama, Two-Phase Heat Spreaders Utilizing Microfabricated Boiling Enhancement Structures, Heat Transfer Engineering, Vol. 25 No. 1, 26-36, January/February 2004.
J. Cook, Y. Joshi, and R. Doraiswami, Interconnect Thermal Management of High Power Packaged Electronic
Architectures, Annual IEEE Semiconductor Thermal Measurement and Management Symposium-Proceedings 2004, Vol. 20, 30-37, 2004.
S. Suman, A. Federov, and Y. Joshi, Cryogenic/Sub-Ambient Cooling of Electronics: Revisited, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, Vol. 1, 224-231, 2004.
M. Patterson, X. Wei, Y. Joshi, and R. Prasher, Numerical Study of Conjugate Heat Transfer in Stacked
Microchannels, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, Vol. 1, 372-380, 2004.
S. Gurrum, Y. Joshi, W. King, and K. Ramakrishna, Numerical Simulation of Electron Transport Through Constriction in a Metallic Thin Film, IEEE Electron Device Letters, Vol. 25 No. 10, 696-698, October 2004.
X. Wei and Y. Joshi, Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components, ASME Transactions Journal of Electronic Packaging, Vol. 126 No. 1, 60-66, March 2004.
J. Rambo and Y. Joshi, Multi-scale Modeling of High Power Density Data Centers, Advances in Electronic Packaging, Vol. 1, 521-527, 2003.
J. Rambo and Y. Joshi, Physical Models in Data Center Airflow Simulations, ASME Heat Transfer Division, Vol. 374 No. 2, 153-159, 2003.
S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi, and Y. Joshi, Evaluation of Analytical Models for Thermal Analysis and Design of Electronic Packages, Microelectronics Journal, Vol. 34, 223- 230, 2003.
C. Ramaswamy, Y. Joshi, W. Nakayama, Effects of Varying Geometrical Parameters On Boiling From Microfabricated Enhanced Structures, ASME Journal of Heat Transfer, Vol. 125, 103-109, 2003.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Semi-Analytical Model for Boiling from Enhanced Structures, International Journal of Heat and Mass Transfer, 2003.
O. Suzuki, Y. Joshi, and W. Nakayama, Dynamics of a Liquid Plug in a Capillary Duct Powered by Vapor Explosion, Microelectronics Journal, Vol. 34 No. 3, 195-200, March 2003.
L. Yuan, Y. Joshi, and W. Nakayama, Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon, Microscale Thermophysical Engineering, Vol. 7 No. 2, 163-179, April/June 2003.
X. Wei and Y. Joshi, Optimization Study of Stacked Micro-channel Heat Sinks for Micro-electronic Cooling, IEEE Transactions on Components and Packaging Technologies, Vol. 26 No. 1, 55-61,
March 2003.
Y. Joshi and S. Garimella, Thermal Challenges in Next Generation Electronic Systems, Microelectronics Journal, Vol. 34 No. 3, 169, March 2003.
P. R. Kaczorowski, Y. Joshi, and S. Azarm, Multi-objective Design of Liquid Cooled Power Electronic
Modules for Transient Operation, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 215-222, 2003.
C. Amon, K. Ramakrishna, B. Sammakia, and Y. Joshi, Special Section on Components and Packaging
Technologies with Contributions from ITherm 2002 Thermal Management Track, IEEE Transactions on Components and Packaging Technologies, Vol. 26 No. 1, 3-5, March 2003.
Y. Joshi, K. Azar, D. Blackburn, C. Lasance, R. Mahajan, and J. Rantala, How Well Can We Assess
Thermally Driven Reliability Issues in Electronic Systems Today? – Summary of Panel Held at the Therminic 2002, Microelectronics Journal, Vol. 34 No. 12 Special Issue, 1195-1201, December 2003.
K. Moores and Y. Joshi, Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array, ASME Journal of Heat Transfer, Vol. 125 No. 6, 999-1006, December 2003.
S. Gurrum, S. Suman, Y. Joshi, and A. Fedorov, Thermal Issues in Next Generation Integrated Circuits, Advances in Electronic Packaging, Vol. 2, 659-664, 2003.
C. Ghiu and Y. Joshi, Boiling Performance of Single-Layered Enhanced Structures, ASME Heat Transfer Division, Vol. 374 No. 2, 175-181, 2003.
S. Gurrum, Y. Joshi, W. King, and K. Ramakrishna, A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method, ASME EEP, Vol. 3 441-445, 2003.
L. Tang and Y. Joshi, A Multigrid Based Multi-Scale Thermal Analysis Approach for Conjugate Problems
Involving Discrete Heating, ASME EEP, Vol. 3, 539-552, 2003.
S. Garimella and Y. Joshi, Foreward-Contributions from Thermal Challenges in Next Generation Electronic Systems (THERMES), IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 4, 567-568, 2002.
S. Garimella, Y. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, V.P. Carey, M. Baelmans, J. Lohan, B. Sammakia, F. Andros, Thermal Challenges in Next Generation Electronic Systems – Summary of Panel
Presentations and Discussions, IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 4, 569-575, 2002.
S. Gurrum, Y. Joshi, and J. Kim, Thermal Management of High Temperature Pulsed Electronics Using Metallic Phase Change Materials, Numerical Heat Transfer Part: A, Vol. 42 No. 8, 777-790, 2002.
S. Gurrum, S. Murthy, and Y. Joshi, Numerical Simulation of Thermocapillary Pumping Using Level Set
Method, 5th ISHMT/ASME Heat and Mass Transfer Conference, January 3-5, Kolkata, India, 2002.
Y. Joshi, W. Nakayama, and S. Haider, A Natural Circulation Model of the Closed Loop, Two-phase Thermosyphon for Electronics Cooling, Journal of Heat Transfer, Vol. 124 No. 5, 881-890, 2002.
S. Kalahasti and Y. Joshi, Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader, IEEE Transactions on Components and Packaging Technologies, Vol. 25, 554-560, 2002.
A. Pal, Y. Joshi, M. Beitelmal, C. Patel, and T. Wenger, Design and Performance Evaluation of a Compact Thermosyphon, IEEE Transactions of Components and Packaging Technologies, Vol. 25 No. 4, 601-607, 2002.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, High Speed Visualization of Boiling from an Enhanced Structure, International Journal of Heat and Mass Transfer, Vol. 45, 4761-4771, 2002.
E. Yu, and Y. Joshi, Heat Transfer Enhancement from Enclosed Discrete Components Using Pin-Fin Heat Sinks, International Journal of Heat and Mass Transfer, Vol. 45, 4957-4966, 2002.
S. Murthy, Y. Joshi, and W. Nakayama, Single Chamber Compact Two-Phase Heat Spreaders with Micro-fabricated Boiling Enhancement Structures, IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 1, 156-163, March 2002.
X. Wei and Y. Joshi, Optimization Study of Stacked Micro-channel Heat Sinks for Micro-electronic Cooling, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, 441-448, 2002.
Y. Joshi, Heat Out of Small Packages, Mechanical Engineering, 56-58, December 2001.
S. Suman, M. Gaitan, Y. Joshi, and G. Harman, Wire Bond Temperature Sensor, IMAPS International Symposium on Microelectronics, October 9-11, Baltimore, 344-349, 2001.
K. Moores, Y. Joshi, and G. Schiroky, Thermal Characterization of a Liquid Cooled AlSiC Base Plate with
Integral Pin Fins, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, 213-219, 2001.
K. Moores and Y. Joshi, High Performance Packaging Materials for Improved Thermal Management of Power Electronics, Future Circuits International, Issue 7, 45-49, 2001.
L. Yuan, Y. Joshi, and W. Nakayama, Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon, Proceedings of 2001 International Mechanical Engineering Congress and Exposition, HTD-Vol. 369 No. 7, 291-299, 2001.
Y. Joshi, M. Baelmans, D. Copeland, C.J.M. Lasance, J. Parry, and J. Rantala, Challenges in Thermal
Modeling of Electronics at the System Level: Summary of Panel Held at the Therminic 2000, IEEE Transactions on Components and Packaging Technologies, Vol. 24 No. 4, 611-613, December 2001.
C. Ghiu, Y. Joshi, and W. Nakayama, Visualization Study of Pool Boiling from Transparent Enhanced
Structures, Proceedings of the National Heat Transfer Conference, Vol. 1, 697-704, 2001.
Q. Zhang, Y. Joshi, A. Dasgupta, and R. Pal, Modeling of Effects of Geometry and Temperature Cycle on
Viscoplastic Deformation and Durability of FCOC Solder Joints, Advances in Electronic Packaging, Vol. 1, 315-322, 2001.
D. Yoo and Y. Joshi, Smart Thermal Management Systems Based on Solid Liquid Phase Change Materials (PCM), Advances in Electronic Packaging, Vol. 2, 601-607, 2001.
S. Bhavnani, A. Bar-Cohen, and Y. Joshi, Evolution and Growth of a Web-Based Electronics Thermal
Management Course, Advances in Electronic Packaging, Vol. 3, 1831-1836, 2001.
S. Haider, Y. Joshi, and W. Nakayama, A Natural Circulation Model of the Closed Loop, Two-Phase
Thermosyphon for Electronics Cooling, ASME Heat Transfer Division, Vol. 369 No. 7, 209-218, 2001.
Lang, Y., Joshi, Y. K. and Nakayama, W., Effect of Condenser Location and Imposed Circulation on the
Performance of a Compact Two-Phase Thermosyphon, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, Banff, Alberta, Canada, October 15-20, 2000, 304-311.
E. Yu and Y. Joshi, Natural Convection Air Cooling of Electronic Components in Partially Open Compact
Horizontal Enclosures, IEEE Transactions on Components and Packaging Technologies, Vol. 23 No. 1, 14-22, 2000.
S. Gurrum, S. P., Joshi, Y. K. and Kim, J., Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials, Proceedings of the 34th National Heat Transfer Conference, Pittsburgh, PA, Aug. 20-22, 2000.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, IEEE Transactions on Component and Packaging Technology, Vol. 23, No.1, 61-69, 2000.
K. Moores, Y. Joshi, and G. Schiroky, Numerical and Experimental Thermal Characterization of a Liquid
Cooled AlSiC Power Electronics Base Plate With Integral Pin Fins, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (ITherm), Vol. 2, 385-390, 2000.
S. Murthy, Y. Joshi, and W. Nakayama, Single Chamber Compact Thermosyphons with Micro-Fabricated
Components, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (ITherm), Vol. 2, 321-327, 2000.
Y. Joshi, J. Sircar, A. Bar-Cohen, K. Geisler, S. Bhavnani, P. Pradeepkumar, and J. Barnes, Distance
Learning in Thermal Design of Electronic Systems: The IEEE/NSF Project, Proceedings-Electronic Components and Technology Conference, 1289-1292, 2000.
D. Pal and Y. Joshi, Melting in a Side Heated Tall Enclosure By a Uniformly Dissipating Heat Source, International Journal of Heat and Mass Transfer, Vol. 44 No. 2, 375-387, 2000.
S. Smee, M. Gaitan, D. Novotny, Y. Joshi, and D. Blackburn, IC Test Structures for Multilayer
Interconnect Stress Determination, IEEE Electron Device Letters, Vol. 21 No. 1, 12-14, 2000.
S. Bhavnani, A. Bar-Cohen, and Y. Joshi, The Classroom of the Future: An Internet-Delivered National
Course on Thermal Management of Electronics, Journal of Engineering Education, Vol. 89 No. 4, 423-427+503+506, October 2000.
K. Moores, Y. Joshi, and G. Miller, Performance Assessment of Thermoelectric Coolers for Use in Thermal
Management of High Temperature Electronics Systems, Proceeding of the 18th International Conference on Thermoelectrics, Baltimore, MD, August 1999.
S. Murthy, Y. Joshi, V. Adams, and K. Ramakrishna, Integrated Thermal Analysis of an Automotive Electronic System, Proceedings of InterPACK’99, vol.1, 979-986, June 1999.
D. Pal and Y. Joshi, Thermal Control of Horizontally Mounted Heat Sources Using Phase Change Materials, ASME EEP, Vol. 26-2, 1625-1630, 1999.
L. Tang and Y. Joshi, Multi-scale Conjugate Thermal Modeling Approach for Air Cooled Electronic Enclosures, ASME EEP, Vol. 26-1, 295-304, 1999.
L. Tang and Y. Joshi, Application of Block-Implicit Multigrid Approach To Three-Dimensional Heat Transfer Problems Involving Discrete Heating, Numerical Heat Transfer; Part A: Applications, Vol. 35 No. 7, 717-734, 1999.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads, Journal of Enhanced
Heat Transfer, Vol. 6 No. 2-4, 279-288, 1999.
Y. Joshi, A. Bar-Cohen, and S. Bhavnani, Internet Based Instruction for Thermal Design of Electronic Products-Making A Global Impact, Proceedings-Electronic Components and Technology Conference,
1060-1064, 1999.
R. Pappu, Y. Joshi, and A. Dasgupta, Localized Thermal Cycling: A Faster and Controlled Accelerated
Testing Approach for Surface Mount Electronics, ASME EEP, Vol. 26-2, 1599-1604, 1999.
Y. Joshi, “Passive Thermal Control of Electronic Equipment”, Chapter 8 of Applied Computational Fluid Dynamics, V. K. Garg (ed.), Marcel Dekker, pp.301-333, 1998.
D. Pal, and Y. Joshi, Transient Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials (PCMs), AIAA Journal of Thermophysics and Heat Transfer, Vol. 12, 256-262, 1998.
Y. Joshi, A. Bar-Cohen, and S. Bhavnani, National Course on Thermal Design of Electronic Products:
Recent Experiences and a Proposal, Proceedings-Electronic Components and Technology Conference, 541-543, 1998.
E. Yu and Y. Joshi, Natural Convection Air Cooling of Electronic Components in Partially Open Compact
Horizontal Enclosures, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, 51-57, 1998.
L. Tang and Y. Joshi, Application of Block-Implicit Multigrid Approach to Heat transfer Problems Involving Discrete Heating, International Mechanical Engineering Congress and Exposition, ASME HTD-Vol. 361, 23-32, 1998.
T. Shah, S. Danziger, K. Moores, and Y. Joshi, Cyanate Ester Die Attach Material for Radiation Hardened Electronic Packages, IEEE Adhesives in Electronics Symposium, Binghamton, N.Y. September 1998.
L. Tang, K. Moores, C. Ramaswamy, and Y. Joshi, Characterizing the thermal performance of a flow through electronic module (SEM-E Format) using a porous media model, Proceedings of the IEEE SEMITHERM XIV Symposium, San Diego, CA, 68-77, March 1998.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Performance of a Compact Two-Chamber Two-Phase Thermosyphon: Effect of Evaporator Inclination, Liquid Fill Volume and Contact Resistance, Proceedings of the International Heat Transfer Conference, Kyongju, South Korea, 1998.
C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, Proceedings of ITherm VI, Seattle, WA, 349-355, 1998.
S. Smee, M. Gaitan, and Y. Joshi, MEMS-Based Test Structures for IC Technology, Mechanical Behavior of Advanced Materials, ASME MD-Vol. 84, 147-149, 1998.
D. Pal and Y. Joshi, Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Packages, Thermal Management of Electronic Systems II, Kluwer Academic
Publishers, Leuven, Belgium, 227-242, 1997.
D. Pal and Y. Joshi, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study, Journal of Electronic Packaging, Transactions of ASME, Vol. 119, 40-50, 1997.
E. Yu and Y. Joshi, Effects of Orthotropic Thermal Conductivity of Substrates in Natural Convention Cooling of Discrete Heat Sources, Numerical Heat Transfer, Vol. 32, 575-593, 1997.
Y. Joshi, A. Bar-Cohen, and S. Bhavnani, Distance Learning Paradigms in Electronics Packaging: A
National Course on Thermal Design of Electronic Products, Proceedings-Electronic Components and Technology Conference, 579-584, 1997.
V. Adams, D. Blackburn, Y. Joshi, and D. Berning, Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems, IEEE Transaction on Components, Packaging, and
Manufacturing Technology Part A, Vol. 20, No. 4, 420-431, 1997.
L. Tang, and Y. Joshi, Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis, IEEE Transaction on Components, Packaging, and Manufacturing Technology Part A, Vol. 20, No. 2, 103-110,
1997.
Y. Joshi, D. Barker and M. Ojalvo, New Graduate Educational Program in Electronic Packaging and Reliability (EPAR), Journal of Engineering Education, Vol. 86 No. 2, 183-187, 1997.
Y. Joshi et al., “An integrated surface mount virtual factory based on mechanistic process simulations Part I – Overall Approach”, ASME Winter Annual Meeting Conference, Nov. 17-22, Atlanta, Georgia, 1996.
Y. Joshi et al., “An integrated surface mount virtual factory based on mechanistic process simulations Part II – Examples of Virtual Factory Models for Surface Mount Manufacturing”, ASME Winter Annual Meeting Conference, Nov. 17-22, Atlanta, Georgia, 1996.
E.Yu and Y. Joshi, Air Cooling of a Component Mounted on a Vertical Substrate in a Vented Enclosure by Combined Conduction, Natural Convection and Radiation, Presented at the ASME International Mechanical Engineering Congress and Exhibition, Atlanta, GA, November 1996.
D. Pal and Y. Joshi, Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages: A omputational Study, Numerical Heat Transfer, Part A, Vol. 30, 19-34, 1996.
C. Argento, Y. Joshi and M. Osterman, Forced Convection Air Cooling of a Commercial Electronic Chassis: An Experimental and Computational Case Study, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 19, No.2, 248-257, 1996.
S. Vikram and Y. Joshi, Natural Convection From a Horizontal Printed Circuit Board in an Enclosure, Proceedings of the 9th International Symposium on transport Phenomena in Thermal Engineering, Singapore, Vol. 1, 486-491, 1996.
L. Tang and Y. Joshi, Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis, ITherm ’96, Proceedings of the 5th Inter-society Conference on Thermal Phenomena in Electronic Systems, Orlando, FL, 217-225, May 1996.
L. Tang, and Y. Joshi, Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure, Proceedings of ASME National Heat Transfer Conference, ASME HTD-Vol. 329 N 7, 211-220, 1996.
E. Yu and Y. Joshi, Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation, Proceedings of the ASME International Mechanical Engineering Congress and Exposition,
Atlanta, GA, HTD-Vol. 333, 323-330, 1996.
Y. Joshi and D. Barker, New Graduate Program in Electronic Packaging and Reliability (EPAR), Biennial University/Government/Industry Microelectronics Symposium-Proceedings, 219-223, 1995.
Y. Joshi and R. Rahall, Mixed Convection Liquid Cooling of Discrete Heat Sources in a Vertical Channel, Fundamentals of Mixed Convection, ASME HTD-Vol. 274, 1-8, 1994.